Title:
ワークの両面研磨装置
Document Type and Number:
Japanese Patent JP7035748
Kind Code:
B2
Abstract:
Provided is a double-sided polishing device for a workpiece that can perform double-sided polishing of the workpiece while maintaining accuracy, for a longer period of time than conventional devices, in measuring the thickness of the workpiece. In this double-sided polishing device 1, an upper surface plate 2 or a lower surface plate is provided with one or more through-holes 10 that penetrate from the top surface to the bottom surface of the upper surface plate 2 or the lower surface plate. A polishing pad 7 is provided with a hole 11 at a position corresponding to the through-hole 10. The double-sided polishing device 1 is further provided with a workpiece thickness measuring device that measures the thickness of a workpiece W while engaging in double-sided polishing of the workpiece W. The present invention is characterized in that: each of the one or more through-holes 10 has inserted therein a solid window member 13; the window member 13 comprises a cylindrical section 14 and a flange section 15 that has a larger diameter than the through-hole 10; a ring-shaped recess 14b is provided in a side surface 14a of the cylindrical section 14; and, in a state where an O-ring 16 is disposed in the ring-shaped recess 14b, the cylindrical section 14 is inserted into the through-hole 10 from the polishing pad 7 side.
Inventors:
Mami Kubota
Keiichi Takanashi
Keiichi Takanashi
Application Number:
JP2018076296A
Publication Date:
March 15, 2022
Filing Date:
April 11, 2018
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B37/013; B24B37/08; B24B49/12; H01L21/304
Domestic Patent References:
| JP2011249833A | ||||
| JP2017052027A |
Foreign References:
| US20030180973 | ||||
| US20030205325 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Keisuke Kawahara
Mitsutsugu Sugimura
Keisuke Kawahara