Title:
ワーク加工装置及びワーク加工方法
Document Type and Number:
Japanese Patent JP7445844
Kind Code:
B2
Abstract:
To provide a work machining device and a work machining method capable of suppressing reduction in throughput caused by correction of an end face of a flange.SOLUTION: A work machining device has: a sensor 300 for detecting a state of an end face 50C of a flange 50; an end face correcting device 400 for abutting a grinding wheel 402 on the end face 50C to grind the end face 50C; and a control unit 78 for controlling the end face correcting device 400 on the basis of a detection result of the sensor 300.SELECTED DRAWING: Figure 5
More Like This:
Inventors:
Yusuke Kaneshiro
Application Number:
JP2019209603A
Publication Date:
March 08, 2024
Filing Date:
November 20, 2019
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B7/16; B24B45/00; B24B49/10; H01L21/304
Domestic Patent References:
| JP2019115961A | ||||
| JP2016007673A | ||||
| JP2006116690A | ||||
| JP2018192603A | ||||
| JP2014159064A | ||||
| JP2017221994A | ||||
| JP2016179520A |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Previous Patent: Drug dispensing device, drug dispensing program
Next Patent: Shape measuring machine and its control method
Next Patent: Shape measuring machine and its control method