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Title:
両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
Document Type and Number:
Japanese Patent JP5212041
Kind Code:
B2
Inventors:
Kazuya Sato
Junichi Ueno
Shuichi Kobayashi
Hideo Kudo
Application Number:
JP2008295527A
Publication Date:
June 19, 2013
Filing Date:
November 19, 2008
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B37/28; B24B37/27; H01L21/304
Domestic Patent References:
JP57157453U
JP2000210863A
JP11019866A
JP11090801A
JP6155286A
JP2001138221A
JP2004122346A
JP2000288921A
Attorney, Agent or Firm:
Mikio Yoshimiya



 
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