Title:
Conductive member and electromagnetic wave shield structure
Document Type and Number:
Japanese Patent JP6354055
Kind Code:
B2
Abstract:
A conductive member (101,1) of this disclosure includes a bent metal thin plate. The metal thin plate includes a base portion (3) having a first surface serving as a joint surface for soldering, a first spring portion (5) connected to part of the base portion (3), and a second spring portion (20) provided above a second surface of the base portion (3) opposite to the first surface. The first spring portion (5) inclines in a direction away from a tangent plane of the first surface such that an angle between the first spring portion (5) and the first surface is an obtuse angle, and generates repulsion force against force toward the tangent plane. The second spring portion (20) generates repulsion force parallel to a direction from the base portion (3) toward the first spring portion (5).
Inventors:
Tatsuya Nakamura
Application Number:
JP2014226508A
Publication Date:
July 11, 2018
Filing Date:
November 06, 2014
Export Citation:
Assignee:
Kitagawa Industry Co., Ltd.
International Classes:
H05K9/00
Domestic Patent References:
| JP2011100887A | ||||
| JP3012495U | ||||
| JP63010000A |
Foreign References:
| WO2009025405A1 |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation
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