Title:
電子装置
Document Type and Number:
Japanese Patent JP7163224
Kind Code:
B2
Abstract:
The electronic device includes first and second semiconductor components. And, the electronic device includes a sealing body for sealing the first semiconductor component (i.e., the logic chip). A plurality of through conductors electrically connected to the first semiconductor component and/or the second semiconductor component is formed in the sealing body. In plan view, the sealing body has a first region in which the first semiconductor component is located, a second region located on a periphery of a first surface of the sealing body, a third region located between the second region and the first region, and a fourth region located between the second region and the third region. The plurality of through conductors is arranged most in the second region. The number of the plurality of through conductors located in the third region is larger than the number of the plurality of through conductors located in the fourth region.
More Like This:
Inventors:
Wataru Shirai
Shuya Kayazaki
Shuya Kayazaki
Application Number:
JP2019048036A
Publication Date:
October 31, 2022
Filing Date:
March 15, 2019
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L25/10; H01L23/12; H01L25/04; H01L25/18; H05K3/46
Domestic Patent References:
| JP2017507499A | ||||
| JP2018093162A | ||||
| JP2006019433A | ||||
| JP2015195263A |
Foreign References:
| WO2017138121A1 |
Attorney, Agent or Firm:
Patent Attorney Tsutsui International Patent Office
Previous Patent: Driving device, driving system, and driving method for electric motor
Next Patent: BUSH CUTTER
Next Patent: BUSH CUTTER