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Title:
Epoxy resin composition, metal-clad laminate, and packaging substrate material
Document Type and Number:
Japanese Patent JP6327460
Kind Code:
B2
More Like This:
JPH09202820EPOXY RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE USING THE SAME
JPH03177415EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING USE
JPS63238124EPOXY RESIN COMPOSITION
Inventors:
Tomoyuki Ishikawa
Minoru Uno
Application Number:
JP2014121351A
Publication Date:
May 23, 2018
Filing Date:
June 12, 2014
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08L63/00; B32B15/08; H05K1/03
Domestic Patent References:
JP2011247996A
JP2009271445A
JP2009235123A
JP8092332A
Foreign References:
WO2008132960A1
WO2009147938A1
WO2010016258A1
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Usami Aya



 
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