Title:
基板冷却手段を備えた成膜装置
Document Type and Number:
Japanese Patent JP4037493
Kind Code:
B2
Inventors:
Yuu Kawamata
Application Number:
JP29562097A
Publication Date:
January 23, 2008
Filing Date:
October 28, 1997
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
C23C14/34; C23C14/50; H01L21/203; H01L21/31
Domestic Patent References:
| JP1252770A | ||||
| JP9199488A | ||||
| JP61237416A |
Attorney, Agent or Firm:
Kazuo Sato
Masamitsu Sato
Hiroyuki Nagai
Junpei Okada
Masamitsu Sato
Hiroyuki Nagai
Junpei Okada