Title:
The fingerprint sensor integrated
Document Type and Number:
Japanese Patent JP6276293
Kind Code:
B2
Abstract:
A fingerprint sensor and fingerprint sensor system especially for integration in a device having an overlay made of an insulating material comprises a plurality of sensing elements positioned on a first side of the overlay; a plurality of probes positioned in a predetermined pattern defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements; a plurality of amplifiers connected to the plurality of sensing elements, the number of amplifiers being less than the number of sensing elements; and an activation circuit connected to the plurality of sensing elements, the activation circuit being adapted to output at least one activation signal.
Inventors:
Ralph W. Bernstein
Nikolai W. Christie
Gale Eval Bledholt
Avin Slougedar
Nikolai W. Christie
Gale Eval Bledholt
Avin Slougedar
Application Number:
JP2015558464A
Publication Date:
February 07, 2018
Filing Date:
February 21, 2014
Export Citation:
Assignee:
IDEX AS
International Classes:
G06F3/041; G06F3/01
Domestic Patent References:
| JP2011050757A | ||||
| JP2002335324A | ||||
| JP2005156291A | ||||
| JP2006162345A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe
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