Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
A heat-resistant Silang bridge construction resin-molding object, a bridge construction resin-molding object, heat-resistant Silang bridge construction resin compositions, those manufacturing methods, the Silang master batch, and heat-resistant products
Document Type and Number:
Japanese Patent JP6140140
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat resistant silane crosslinked resin molded body excellent in long term heat resistance, heat deformation resistance and cold resistance in addition to mechanical properties and fire retardant and a manufacturing method therefor, a crosslinkable resin molded body and heat resistant silane crosslinkable resin composition and manufacturing method of them, a silane master batch and heat resistant product.SOLUTION: There are provided a manufacturing method, where a process (a) of obtain a mixture by melting and mixing a base resin, aromatic peroxide, metal hydrate, bromine-based flame retardant, antimony trioxide, a silane coupling agent and a silanol condensation catalyst at a predetermined mass ratio has a process (a1) of preparing silane MB by melting and mixing a part or all of the base resin, organic peroxide and a silane coupling agent, a process (a2) of preparing catalyst MB and a process (a3) of melting and mixing the silane MB, the silanol condensation catalyst and the catalyst MB and the bromine-based flame retardant and the antimony trioxide are mixed in at least one of the processes (a1) and (a2), a heat resistant silane crosslinked resin molded body manufactured by the same and a heat resistant product.SELECTED DRAWING: None

Inventors:
Yusuke Kuwazaki
Masami Nishiguchi
Minoru Saito
Application Number:
JP2014259924A
Publication Date:
May 31, 2017
Filing Date:
December 24, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C08J5/00; C08J3/22; C08J3/24; C08K3/22; C08K5/02; C08K5/14; C08K5/5415; C08L23/08; C08L23/10; C08L31/04
Domestic Patent References:
JP11172002A
JP53065347A
JP2014009236A
JP2009051918A
JP2006131720A
Foreign References:
WO2012169298A1
WO2013147148A1
Attorney, Agent or Firm:
Toshizo Iida
Ikuo Shinoda



 
Previous Patent: The system for games

Next Patent: HEATING DEVICE FOR DISSOLVING