Title:
A laser beam machining device and a laser beam machining method
Document Type and Number:
Japanese Patent JP6121924
Kind Code:
B2
Abstract:
A laser processing apparatus for radiating a laser beam to a member to be treated provided in an air environment to perform surface treatment. The member to be treated forms a structure extending in a vertical direction. The laser processing apparatus includes: a liquid supply mechanism that jets and supplies liquid to a surface of the member to be treated; a laser radiation mechanism that radiates the laser beam in pulses to the surface of the member to be treated via the liquid; and a cylindrical gas laminar flow nozzle disposed below the liquid supply mechanism and configured to jet a gas upward to form a gas flow surrounding the member to be treated around an axis direction thereof.
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Inventors:
Nomura Kodai
Yuji Sano
Kaku Senda
Katsunori Shiihara
Hiroya Ichikawa
Yuji Sano
Kaku Senda
Katsunori Shiihara
Hiroya Ichikawa
Application Number:
JP2014030859A
Publication Date:
April 26, 2017
Filing Date:
February 20, 2014
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B23K26/142; B23K26/12; B23K26/356; C21D9/00; C21D9/50
Domestic Patent References:
| JP2010120038A | ||||
| JP2009226417A | ||||
| JP200729973A | ||||
| JP63135897A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office