Title:
A laser beam machining device used for the bending method and the bending method of metal plate material
Document Type and Number:
Japanese Patent JP6170386
Kind Code:
B2
Inventors:
Kim Shun
Takashi Sakai
Akihiko Sugiyama
Lee Wakato
Takashi Sakai
Akihiko Sugiyama
Lee Wakato
Application Number:
JP2013187228A
Publication Date:
July 26, 2017
Filing Date:
September 10, 2013
Export Citation:
Assignee:
Amada Holdings Co., Ltd.
International Classes:
B21D5/02; B21D11/20
Domestic Patent References:
| JP5038522A | ||||
| JP2013177675A | ||||
| JP2006219763A | ||||
| JP2004091870A | ||||
| JP5038524A | ||||
| JP5057465A |
Foreign References:
| WO2012029717A1 |
Other References:
松本克史 外1名,自動車パネル用Al-Mg-Si合金の集合組織形成挙動に及ぼす溶体化処理の影響,神戸製鋼技報,日本,2004年12月,Vol54 No.3,URL,http://web.archive.org/web/20050512223643/http://www.kobelco.co.jp/technology-review/pdf/54_3/047-50.pdf
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Previous Patent: A measuring device, a measuring method, and a manufacturing method of an article
Next Patent: JPS6170387
Next Patent: JPS6170387