Title:
THERMAL CONDUCTIVE PRESSURE SENSITIVE LAMINATE SHEET (F), MANUFACTURING METHOD OF THERMAL CONDUCTIVE PRESSURE SENSITIVE LAMINATE SHEET (F) AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2016210936
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal conductive pressure sensitive laminate sheet (F) excellent in flexibility and shape followability with low hardness and low compressive stress and further excellent in reworkability.SOLUTION: There is provided: a thermal conductive pressure sensitive laminate sheet (F) having a thermal conductive pressure sensitive adhesive layer obtained by conducting a polymerization reaction of at least a (meth)acrylic acid ester monomer (α1) and a polyfunctional monomer (α2) after molding or while molding a mixture composition containing 100 pts.mass of a (meth)acrylic resin composition (A) containing a (meth)acrylic acid ester polymer (A1), the (meth)acrylic acid ester monomer (α1) and the polyfunctional monomer (α2) having a plurality of polymerizable unsaturated bonds of 0.2 mass% to 3 mass%, 3 pts.mass to 25 pts.mass of silicone (S), 30 pts.mass to 100 pts.mass of a plasticizer (C) and 300 pts.mass to 700 pts.mass of a thermal conductive filler (E) to a sheet-like shape; and a non-adhesive layer having no adhesiveness.SELECTED DRAWING: Figure 1
Inventors:
TANAKA HIDEKAZU
KUMAMOTO TAKURO
KOBAYASHI HAJIME
KUMAMOTO TAKURO
KOBAYASHI HAJIME
Application Number:
JP2015097550A
Publication Date:
December 15, 2016
Filing Date:
May 12, 2015
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
C09J133/04; C09J4/00; C09J7/02; C09J11/04; C09J11/06
Attorney, Agent or Firm:
Noriyuki Yamamoto
Akihiko Yamashita
Kishimoto Tatsuto
Akihiko Yamashita
Kishimoto Tatsuto