Title:
感熱性を有する誘電材料をレーザビームで精密に研磨/構造化する方法
Document Type and Number:
Japanese Patent JP2008538324
Kind Code:
A
Abstract:
The invention relates to a method for finely polishing/structuring thermosensitive dielectric materials, in particular materials exhibiting a low thermal expansion coefficient, by a laser beam consisting in directing an intensive ultrashort laser beam to a processable material surface, in adjusting the action time within a range from 10-13 s to 10-11 s and a laser pulse energy in such a way that it is less than an ablation threshold but sufficient for provoking a Coulomb explosion. The inventive method makes it possible to carry out a material removal within a nanometer range by means of laser ultrashort pulses ranging between picoseconds and subpicoseconds, wherein the material surface is finely polished during a pre-ablation process step (removal less than the ablation range) and the processable surface is low-heated (approximately up to 10 ° C., only) due to the extremely shot laser beam action time.
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Inventors:
Ellen Trout Roots
Hether Inn Golf
Rosenfield Arkadi
Hether Inn Golf
Rosenfield Arkadi
Application Number:
JP2008507036A
Publication Date:
October 23, 2008
Filing Date:
March 21, 2006
Export Citation:
Assignee:
Fortune Verand Berlin Eevee
International Classes:
B23K26/36; B23K26/40
Attorney, Agent or Firm:
Shinji Aida