Title:
ホスホニウム系化合物、それを含むエポキシ樹脂組成物、およびそれを用いて製造された半導体装置
Document Type and Number:
Japanese Patent JP6803138
Kind Code:
B2
Abstract:
A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
Inventors:
Money
I'm sing a sup -i.e.
Lee Dong
Zheng lord swimming
Akira Chiaki
Choi
I'm sing a sup -i.e.
Lee Dong
Zheng lord swimming
Akira Chiaki
Choi
Application Number:
JP2015207460A
Publication Date:
December 23, 2020
Filing Date:
October 21, 2015
Export Citation:
Assignee:
SAMSUNG SDI Co., LTD.
International Classes:
C07F9/54; C07C39/08; C07C39/15; C07C39/17; C07C49/83; C07C235/60; C07C235/64; C07C235/66; C07C259/10; C07C323/20; C08G59/68; C08K5/50; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2002105171A | ||||
| JP2002179768A | ||||
| JP2003292584A |
Attorney, Agent or Firm:
Hatta International Patent Corporation