Printed wiring board material and printed wiring board using it

Title:

Printed wiring board material and printed wiring board using it

Document Type and Number:

Japanese Patent JP6317069

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a printed wiring board material capable of achieving a lower linear expansion coefficient compared to the conventional ones and to provide a printed wiring board using the same.SOLUTION: The printed wiring board material includes: a binder component; a cellulose nanofiber having a number-average fiber diameter of 3 nm to 1000 nm, and a sheet silicate. The printed wiring board material may be suitably used for a solder resist, an interlayer insulation material of a multi-layer printed wiring board, and a core material. The printed wiring board material is used for the printed wiring board.

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Inventors:

Daisuke Shibata
Takenori Sumiya
Endo Arata
Shigeru Ushiki
Takao Miwa

Application Number:

JP2013097983A

Publication Date:

April 25, 2018

Filing Date:

May 07, 2013

Export Citation:

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Assignee:

Taiyo Holdings Co., Ltd.

International Classes:

H05K1/03; H05K3/28; H05K3/46

Domestic Patent References:

JP2012119470A
JP4107394B2

Attorney, Agent or Firm:

Ichiro Honda
Yumiko Sugimoto
Atsushi Shinoda
Watari Takumi
Takashi Otaguro

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