Title:
The printed wired board or the cathode material for batteries using copper foil excellent in adhesion nature with resin, a manufacturing method for the same, and the electrolytic copper foil
Document Type and Number:
Japanese Patent JP6029590
Kind Code:
B2
Abstract:
An electrolytic copper foil is characterized by having a roughened surface (M surface) on which roughening particles are formed, wherein the roughening particles have an average size of 0.1 to 1.0 mum. Provided is the electrolytic copper foil capable of, without deteriorating various characteristics of the electrolytic copper foil, improving a roughening treatment layer on the copper foil and enhancing the adhesion strength between the copper foil and a resin substrate, especially, capable of obtaining a stronger peeling strength in comparison with a general-purpose epoxy resin substrate (FR-4, etc.) when used in combination with a semiconductor package substrate having a generally low adhesion with a copper foil and a liquid crystal polymer substrate, and also provided is a method for manufacturing the electrolytic copper foil. The present invention addresses the problem of providing the electrolytic copper foil useful as an electrolytic copper foil to be used for a printed wiring board or a battery (LiB, etc.) negative electrode material.
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Inventors:
Tomoki Kobiki
Akimasa Moriyama
Akimasa Moriyama
Application Number:
JP2013536189A
Publication Date:
November 24, 2016
Filing Date:
September 18, 2012
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; C25D3/58; C25D5/48; H01M4/66; H05K1/09
Domestic Patent References:
| JP7231152A | ||||
| JP2006210689A | ||||
| JP2006299291A | ||||
| JP2011168887A | ||||
| JP2011179053A |
Foreign References:
| WO2009145207A1 | ||||
| WO2010110092A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation