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Title:
A processing device of a work
Document Type and Number:
Japanese Patent JP6269450
Kind Code:
B2
Abstract:
A machining apparatus for a workpieces includes an upper turn table support mechanism supporting an upper turn table from above to be vertically movable by a cylinder extending along a rotational axis direction of the table, a horizontal plate fixed to the cylinder so that a main surface thereof becomes perpendicular to a longitudinal axis of the cylinder, at least three displacement sensors which measure horizontal plate surface height positions when the upper turn table has moved down to a fixed position, and a control apparatus to calculate a relative upper turn table height position and an angle formed between the upper turn table rotational axis and the cylinder longitudinal axis from the horizontal plate surface height positions measured by the displacement sensors. A workpiece holding abnormality can be accurately and quickly detected before machining the workpiece to avoid damage, and an cylinder eccentric angle can be detected during machining.

Inventors:
Taichi Yasuda
Enomoto Tatsuo
Application Number:
JP2014233585A
Publication Date:
January 31, 2018
Filing Date:
November 18, 2014
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B37/005; B24B37/08; H01L21/304
Domestic Patent References:
JP2013078826A
JP2106269A
JP2008036802A
JP62195446U
Attorney, Agent or Firm:
Mikio Yoshimiya



 
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