Title:
加工装置
Document Type and Number:
Japanese Patent JP7285754
Kind Code:
B2
Abstract:
A processing apparatus includes a holding table for holding a workpiece, a cutting unit including a spindle and a mount, a blade changer unit for mounting a cutting blade on or dismounting a cutting blade from the mount, and a control unit. The blade changer unit includes a blade chuck for holding the cutting blade and a moving unit. The cutting unit includes a vibration detecting sensor. The control unit includes a calculator for calculating the central axis of the mount from a position where the vibration detecting sensor detects vibrations caused upon contact between the mount and the blade chuck, and a mounting/dismounting controller for aligning the central axis of the blade chuck with the central axis of the mount and mounting the cutting blade on and dismounting cutting blade from the mount.
More Like This:
Inventors:
Kazuki Terada
Application Number:
JP2019187105A
Publication Date:
June 02, 2023
Filing Date:
October 10, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B27/06; B24B45/00; B28D1/24; H01L21/301
Domestic Patent References:
| JP2016144838A | ||||
| JP10340867A | ||||
| JP10249726A | ||||
| JP2020121370A |
Foreign References:
| US5220749 |
Attorney, Agent or Firm:
Sakai International Patent Office