A resin composition and a forming object

Japanese Patent JP5971259

B2

Provided are a resin composition and a shaped article obtained therefrom, which are advantageous not only in that they have practically satisfactory heat resistance, mechanical properties, and shapability as well as excellent resistance to moisture and heat, but also in that both the suppression of the amount of formaldehyde generated and high resistance to moisture and heat, which are contradictory properties, can be achieved. A resin composition which comprises 100 parts by weight of (A) a polyacetal copolymer, wherein the amount of oxyalkylene units having 2 or more carbon atoms contained in the polyacetal copolymer is, per 100 mol of oxymethylene units of the polyacetal copolymer, 0.4 to 17.0 mol, relative to 100 parts by weight of the polyacetal copolymer (A), 0.01 to 1.0 part by weight of (B) an amine-substituted triazine compound, 0.01 to 5.0 parts by weight of (C) a hindered phenol, 0.001 to 3.0 parts by weight of (D) a hindered amine, and 0.001 to less than 0.005 part by weight of (E) at least one metal-containing compound selected from the group consisting of a hydroxide, an inorganic acid salt, and an alkoxide of an alkali metal or an alkaline earth metal.

JP5936335	Polyacetal resin constituent
JPH09213138	ELECTRIC WIRE AND CABLE
JP2024515709	Polymer composition with mold release properties

Mikihiro Shinai
Akira Ito

JP2013550203A

August 17, 2016

December 03, 2012

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Mitsubishi Gas Chemical Co., Ltd.

C08L59/04; C08K3/22; C08K5/13; C08K5/24; C08K5/3435; C08K5/3492

JP2008007676A
JP7179722A
JP2006111874A
JP2004026857A
JP63063741A
JP2004522810A
JP2008195755A
JP4296348A

Patent business corporation Tsukuni
Hajime Tsukuni
Yasuo Yanagibashi
Toshio Miyake
Akio Shibata
Yoko Tanaka

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