Title:
A resin composition for semiconductor closure, and a semiconductor device
Document Type and Number:
Japanese Patent JP6065975
Kind Code:
B2
Abstract:
The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler. In the general formulae (1), (2-1) and (2-2), each of X 2 , X 3 and X 4 independently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula "-SO 2 -" or "-CO-", an oxygen atom or a single bond.
Inventors:
Ozaki Yui
Yamashita Katsushi
Satoshi Kashino
Yamashita Katsushi
Satoshi Kashino
Application Number:
JP2015522830A
Publication Date:
January 25, 2017
Filing Date:
June 11, 2014
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L37/00; C08K5/3472; C08L61/34; H01L23/29; H01L23/31
Domestic Patent References:
| JP2012097206A | 2012-05-24 | |||
| JPH10259248A | 1998-09-29 | |||
| JP2012097207A | 2012-05-24 | |||
| JP2011048064A | 2011-03-10 | |||
| JP2010256717A | 2010-11-11 |
Foreign References:
| WO2012099847A2 | 2012-07-26 |
Attorney, Agent or Firm:
Sumio Tanai
Osamu Mikuni
Shunsuke Fushimi
Osamu Mikuni
Shunsuke Fushimi
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