Title:
樹脂モールド金型
Document Type and Number:
Japanese Patent JP7121705
Kind Code:
B2
Abstract:
The invention provides a resin plastic package mold which can perform resin plastic package without damage even if a workpiece is warped because of being heated from the resin plastic package mold. The resin plastic package mold (10) carries in a workpiece (W) holding an electronic component (Wb) on a base material (Wa) together with a plastic package resin (R) and performs resin plastic package, and has: a workpiece position regulation unit (50) that regulates the allowable outer edge position of the workpiece (W) when the workpiece (W) is mounted on the resin plastic package mold (10), the workpiece position regulation unit (50) being provided so as to regulate the outer edge position thereof; when the mold is closed, a predetermined acting force generated when the workpiece (W) is deformed is borne, and the workpiece can move outwards along the mold surface.
Inventors:
Kenji Nakajima
Application Number:
JP2019138583A
Publication Date:
August 18, 2022
Filing Date:
July 29, 2019
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C33/12; B29C45/26
Domestic Patent References:
| JP2006181734A | ||||
| JP2018192712A | ||||
| JP2017024398A | ||||
| JP10284527A | ||||
| JP2002187160A |
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office
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