Title:
試料支持体
Document Type and Number:
Japanese Patent JP7217714
Kind Code:
B2
Abstract:
A sample support body is a sample support body for ionizing a sample, including: a substrate having an irregular porous structure formed to communicate a first surface and a second surface opposite to each other; and a conductive layer provided at least on the first surface.
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Inventors:
Masahiro Otani
Takayuki Omura
Takamasa Ikeda
Takayuki Omura
Takamasa Ikeda
Application Number:
JP2019570316A
Publication Date:
February 03, 2023
Filing Date:
November 30, 2018
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
G01N27/62
Domestic Patent References:
| JP2009080106A |
Foreign References:
| US20110123411 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Yoshiki Kuroki
Kenichi Shibayama
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