Title:
SEALING MATERIAL SUPPLY AMOUNT MEASUREMENT METHOD OF TERMINAL WITH WIRE, METHOD FOR MANUFACTURING TERMINAL WITH WIRE, AND SEALING MATERIAL SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2017004821
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a terminal with a wire, and to provide a sealing material supply amount measurement method enabling supply amount control of a sealing material and thickness control of a sealing portion and a method for manufacturing the same, and a sealing material supply device.SOLUTION: A sealing material supply amount measurement method includes: forming a wire/terminal connection section 16, and then performing photography from a predetermined position with a camera (initial state photographing step S11); forming an anticorrosion section 4 so as to cover the wire/terminal connection section 16, making the anticorrosion section 4 supply an anticorrosion material 20 formed of an ultraviolet curable resin to the wire/terminal connection section 16 (anticorrosion material supply step S3); irradiating the anticorrosion material 20 with ultraviolet rays to cure the anticorrosion with the ultraviolet rays (anticorrosion material curing step S4); photographing a state after the anticorrosion material 20 has been supplied with a camera in a time period from a time after the anticorrosion material 20 has been supplied to a time before the anticorrosion material 20 is irradiated with the ultraviolet rays (state after supply photographing state S14); and comparing the image obtained by the photography to an image before supply, measuring the total supply amount of the anticorrosion material 20 in a terminal 1 with a wire, and determining the quality concerning the supply of the anticorrosion material 20 (total supply amount measuring step/anticorrosion material supply determining step S15).SELECTED DRAWING: Figure 7
Inventors:
MIYAGAWA DAISUKE
Application Number:
JP2015118953A
Publication Date:
January 05, 2017
Filing Date:
June 12, 2015
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H01B13/00; H01B13/32; H01R43/00
Domestic Patent References:
| JP2012209051A | 2012-10-25 | |||
| JP2002267901A | 2002-09-18 |
Attorney, Agent or Firm:
Yasushi Kobayashi
Rikuna Tomoyuki
Rikuna Tomoyuki