Title:
ソケット
Document Type and Number:
Japanese Patent JP7301699
Kind Code:
B2
Abstract:
To provide a socket which is placed in contact with a contact pad of an electronic component bottom surface to transmit signals and electric power while suppressing an overall contact pressure.SOLUTION: A socket 1 includes: a plate-like housing 20; a signal contact; and a power contact 40A. The plate-like housing 20 has a number of through holes aligned. Further, the power contact 40A has a wide base part 41, a contact beam 42, and solder parts 43. The base part 41 is press-fitted in a through hole 21 which is wide in a longitudinal direction. The contact beam 42 comprises: sub beams 422 erected from the base part 41 to the oblique upper side; a beam 423 connecting upper ends of the sub beams 422; and contact points 424 located on the beam 423. The power contact 40A has the two solder parts 43. Solder balls 80 are respectively connected to the two solder parts 43.SELECTED DRAWING: Figure 4
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Inventors:
Naoki Hashimoto
Tokii Taguchi
Tokii Taguchi
Application Number:
JP2019171526A
Publication Date:
July 03, 2023
Filing Date:
September 20, 2019
Export Citation:
Assignee:
Tyco Electronics Japan G.K.
International Classes:
H01R33/76
Domestic Patent References:
| JP200898051A | ||||
| JP200414507A | ||||
| JP1501982A |
Foreign References:
| US20190288431 |
Attorney, Agent or Firm:
Masanori Yamada
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