Title:
WAFER DIVISION METHOD
Document Type and Number:
Japanese Patent JP2016119323
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer division method by which a wafer can be appropriately divided along a scheduled division line even when a device formation region is not sectioned by a linear schedule division line crossing the wafer.SOLUTION: A schedule division line which sections a device formation region in a hexagonal shape is detected, and laser ray is irradiated to a wafer along the detected scheduled division line using laser ray irradiating means to form a modified layer in the wafer (a step S2). A suctioning member that has a shape similar to the hexagonal shape and has a suctioning region rather smaller than the device is contacted with a backside of the wafer so as to make the suctioning member to suction a device to be divided (a step S3). With the device suctioned by the suctioning member, the suctioning member and the wafer around the device are relatively moved in directions separating from each other, and the device suctioned by the suctioning member is divided along the scheduled division line around the device. (a step S4).SELECTED DRAWING: Figure 3
Inventors:
AOKI SHINYA
Application Number:
JP2014256242A
Publication Date:
June 30, 2016
Filing Date:
December 18, 2014
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Domestic Patent References:
| JP2007141998A | 2007-06-07 | |||
| JPH04188840A | 1992-07-07 |
Foreign References:
| WO2007099725A1 | 2007-09-07 |
Attorney, Agent or Firm:
Hiroaki Sakai