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Title:
THERMAL TRANSFER RIBBON AND ID CARD
Document Type and Number:
Japanese Patent JP2017052203
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal transfer ribbon which enhances adhesiveness between a card substrate and a protective film layer while maintaining the strength of the protective film layer, and to provide an ID card.SOLUTION: The thermal transfer ribbon according to an embodiment includes: a transfer substrate; a protective film layer containing high-melting-point fine particles and low-melting-point fine particles and formed on the transfer substrate; and an adhesive layer formed on the protective film layer. The melting point Th of the high-melting-point fine particles is higher than a temperature T at which the adhesive layer is heated during thermal transfer. The melting point Tl of the low-melting-point fine particles is lower than the temperature T. The blending ratio by weight of the high-melting-point fine particles (a) to the low-melting-point fine particles (b) is 1.14≤a/b≤2.00.SELECTED DRAWING: Figure 3

Inventors:
KANAI YORIKO
Application Number:
JP2015178601A
Publication Date:
March 16, 2017
Filing Date:
September 10, 2015
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B41M5/26; B32B7/06; B41J35/26; B41M5/382; B42D25/23; B42D25/40
Attorney, Agent or Firm:
Takumi Hara
Naomi Hattori
Ryosuke Asano