The tin plating method of copper alloy material

Japanese Patent JP6114770

B2

The present invention relates to a method for tin plating a copper alloy. According to the present invention, when the method for tin plating a copper alloy is used, an amount of a black powder generated on a surface of a tin plate is able to be reduced, and generation of spots on the surface is able to be prevented while enhancing gloss. The method for tin plating a copper alloy in accordance with the present invention exhibits outstanding effects in the aspects of preventing the generation of the black powder, enhancing glossiness, reducing the generation of spots, and enhancing an efficiency of production. The method for tin plating a copper alloys comprises: a step of electrolytic degassing a copper alloy; a step of dipping the resultant product in acid; a step of tin undercoating the resultant product; a step of pre-immersing the resultant product; a step of tin plating the resultant product; a step of fluxing the resultant product with an antioxidant at 5-30°C for 5-10 seconds; a step of reflowing the resultant product at 500-600°C for 1-3 minutes; and a step of drying the resultant product at 100-300°C for 1-5 minutes.

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Lee, Bum Jae
Lee, Gino
Yang, Caps

JP2015042156A

April 12, 2017

March 04, 2015

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PNT Company Limited

C25D5/48; C25D5/34; C25D5/50

JP2006307343A
JP4601670B2

Yoshiyuki Kawaguchi
Shinichi Sanuki
Takeshi Niwa
Toshiaki Shimoda

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