Title:
An ultrasonic probe device which has an ultrasonic probe module and this which have a unit ultrasonic wave probe and this
Document Type and Number:
Japanese Patent JP6058208
Kind Code:
B2
Abstract:
The present invention relates to a unit ultrasonic wave probe, an ultrasonic wave probe module, and an ultrasonic wave probe device. The unit ultrasonic probe according to the present invention includes: a rear block part; a flexible substrate part arranged on the top of the rear block part; and a piezoelectric wafer arranged on the top of and electrically connected with the flexible substrate part, the wafer being formed to have a smaller size than the rear block part, so that even if increasing the number of piezoelectric wafers transversely, the number of channels is increased by depositing the unit ultrasonic wave probe including the piezoelectric wafer, thus preventing the cost from geometrically increasing because of the structure of the flexible substrate becoming complex.
Inventors:
Park, Onesop
Application Number:
JP2016507881A
Publication Date:
January 11, 2017
Filing Date:
April 02, 2014
Export Citation:
Assignee:
HUMANSCAN CO.,Ltd.
International Classes:
A61B8/14; H04R17/00; H04R31/00
Domestic Patent References:
| JP201290662A |
Attorney, Agent or Firm:
Eio Furuya
Tadashi Matsushita
Tadashi Matsushita