Title:
2.5D PACKAGING STRUCTURE AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/045757
Kind Code:
A1
Abstract:
Provided in the present invention are a 2.5D packaging structure and a preparation method. Packages each comprising an adapter plate, a chip and a packaging layer, which are electrically connected, are first prepared, the independently arranged packages are electrically connected by means of connecting bridges to form an interconnected package, and the interconnected package is then electrically connected to a substrate. In this way, a plurality of small-size adapter plates can be electrically connected to each other by means of the connecting bridges to form a large-size adapter plate, thereby increasing the bandwidth and decreasing the delay between the chips. Moreover, the difficulty of preparing the large-size adapter plate can be reduced, the cost is reduced, and the yield is improved.
Inventors:
CHEN YENHENG (CN)
LIN CHENGCHUNG (CN)
YANG JIN (CN)
LIN CHENGCHUNG (CN)
YANG JIN (CN)
Application Number:
PCT/CN2023/099207
Publication Date:
March 07, 2024
Filing Date:
June 08, 2023
Export Citation:
Assignee:
SJ SEMICONDUCTOR JIANGYIN CORP (CN)
International Classes:
H01L21/50; H01L21/56; H01L21/60; H01L23/31; H01L23/498; H01L23/538
Foreign References:
| CN115148611A | 2022-10-04 | |||
| CN107104096A | 2017-08-29 | |||
| CN112908947A | 2021-06-04 | |||
| CN107408515A | 2017-11-28 | |||
| CN213936169U | 2021-08-10 |
Attorney, Agent or Firm:
J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (GENERAL PARTNERSHIP) (CN)
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