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Title:
3D DYNAMIC FORMING OPTIMIZATION DESIGN METHOD FOR CERAMIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221332
Kind Code:
A1
Abstract:
A 3D dynamic forming optimization design method for a ceramic device. Layered slicing processing is carried out on a 3D ceramic model, exposure, curing, demolding and forming processing are carried out by using the slice images comprised in a 3D ceramic model slice image set as projection image sources, it is unnecessary to perform 3D printing on a ceramic slurry, and layer-by-layer curing forming of a ceramic blank can also be carried out, so that batch production of the ceramic blanks can be realized, the production efficiency of the ceramic blanks is improved, and the production cost of the ceramic blanks is reduced.

Inventors:
WANG YIHUAI (CN)
MA XIAOHU (CN)
HAN DONG (CN)
YE KEYANG (CN)
ZHANG LU (CN)
LI ZHIAI (CN)
Application Number:
PCT/CN2022/116054
Publication Date:
November 23, 2023
Filing Date:
August 31, 2022
Export Citation:
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Assignee:
UNIV SOOCHOW (CN)
International Classes:
B28B1/00; B28B1/24; B33Y10/00; B33Y50/00; G06F30/10; G06T17/00; G06T19/20
Domestic Patent References:
WO2018033109A12018-02-22
WO2021068386A12021-04-15
Foreign References:
CN114770696A2022-07-22
CN114292092A2022-04-08
CN112851339A2021-05-28
CN113461427A2021-10-01
CN108422660A2018-08-21
CN111873431A2020-11-03
CN107932691A2018-04-20
CN110511002A2019-11-29
CN110654028A2020-01-07
CN111761817A2020-10-13
CN113334767A2021-09-03
US20220048112A12022-02-17
Attorney, Agent or Firm:
SUZHOU JIANSHAN INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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