Title:
ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL
Document Type and Number:
WIPO Patent Application WO/2017/056877
Kind Code:
A1
Abstract:
Before bonding abrasive grain (13) to a core wire (11), a palladium coating (17) is applied to the surface of the abrasive grain (13). The palladium coating (17) is formed as a sea on the surface of the diamond grains (14). In other words, the palladium coating (17) covers the surface of the diamond grains (14) so that the entirety thereof is continuous. Moreover, the palladium coating (17) does not completely cover the diamond grains (14), and a diamond exposed portion (18) is provided by the palladium coating (17) not being applied on a portion thereof. The exposed diamond portion (18) is formed as an island on the surface of the abrasive grain (13). In other words, a plurality of diamond exposed portions (18) are formed as islands separated from each other.
Inventors:
TANAKA NAOKI (JP)
MATSUNAGA YOSHINORI (JP)
KUBOTA TETSUJI (JP)
MATSUNAGA YOSHINORI (JP)
KUBOTA TETSUJI (JP)
Application Number:
PCT/JP2016/076188
Publication Date:
April 06, 2017
Filing Date:
September 06, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B24D11/00; B23D61/18; B24D3/00; B24D3/06
Domestic Patent References:
| WO2011042931A1 | 2011-04-14 |
Foreign References:
| JP2013136142A | 2013-07-11 | |||
| JP2014188655A | 2014-10-06 | |||
| JP2010120116A | 2010-06-03 |
Other References:
See also references of EP 3357642A4
Attorney, Agent or Firm:
INOUE, Seiichi (JP)
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