ABRASIVE AND METHOD OF POLISHING

WIPO Patent Application WO/2004/107429

A1

An abrasive comprising a slurry obtained by dispersing particles of a tetravalent metal hydroxide in a medium and an additive, wherein the additive is a polymer containing at least one monomer component selected from the group consisting of monomers represented by the general formulae (I) and (II) (wherein R₁ is hydrogen, methyl, phenyl, benzyl, chloro, difluoromethyl, trifluoromethyl, or cyano; R₂ and R₃ are each hydrogen, C_1-18 alkyl, methylol, acetyl, or diacetonyl, with the proviso that the case wherein both are hydrogen is excluded; and R₄ is morpholino, thiomorpholino, pyrrolidinyl, or piperidino). The particles together with a film to be polished form a chemical reaction layer and the substrate is polished without abrasion flaws by virtue of a highly slight mechanical action of the particles and mechanical removal by a pad, the additive enabling the substrate to be highly flattened.

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KOYAMA NAOYUKI (JP)
MACHII YOUICHI (JP)
YOSHIDA MASATO (JP)
FUKASAWA MASATO (JP)
ASHIZAWA TORANOSUKE (JP)

PCT/JP2004/007746

December 09, 2004

May 28, 2004

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HITACHI CHEMICAL CO LTD (JP)
KOYAMA NAOYUKI (JP)
MACHII YOUICHI (JP)
YOSHIDA MASATO (JP)
FUKASAWA MASATO (JP)
ASHIZAWA TORANOSUKE (JP)

B24B37/00; C09G1/02; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14

JP2002241739A	2002-08-28
JP2001107089A	2001-04-17
JP2001057351A	2001-02-27

Miyoshi, Hidekazu (Toranomon 1-chome Minato-ku, Tokyo, JP)

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