Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, RESIN MATERIAL FOR SOLDER RESIST, AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/049721
Kind Code:
A1
Abstract:
The present invention provides an acid group-containing (meth)acrylate resin characterized by containing, as essential reaction raw materials, (A) a phenolic hydroxyl group-containing resin, (B1) a cyclic carbonate compound or (B2) a cyclic ether compound, (C) a N-alkoxyalkyl (meth)acrylamide compound and (D) an acid anhydride. This acid group-containing (meth)acrylate resin exhibits high light sensitivity and excellent alkali developing performance, and can form a cured product having excellent insulation reliability.
Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2018/031689
Publication Date:
March 14, 2019
Filing Date:
August 28, 2018
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/28; C08F20/58; C08G8/30; G03F7/027; G03F7/032
Domestic Patent References:
| WO2002024774A1 | 2002-03-28 |
Foreign References:
| JP2011065087A | 2011-03-31 | |||
| JP2004359728A | 2004-12-24 | |||
| JPH0743902A | 1995-02-14 | |||
| JPH0238411A | 1990-02-07 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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