ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFORM LAYER, METHOD FOR PRODUCING JOINING SHEET, METHOD FOR PRODUCING JOINING SUBSTRATE, AND METHOD FOR PRODUCING JOINED BODY

Title:

ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFORM LAYER, METHOD FOR PRODUCING JOINING SHEET, METHOD FOR PRODUCING JOINING SUBSTRATE, AND METHOD FOR PRODUCING JOINED BODY

Document Type and Number:

WIPO Patent Application WO/2023/080250

Kind Code:

A1

Abstract:

This acidic electrolytic copper plating liquid contains: a soluble copper salt; a specific azole compound that is a copper ion electrodeposition inhibitor and that has two or three nitrogen atoms in a five-membered ring; an acid; and water. The copper concentration is 0.1 mol/L or greater, the azole compound concentration is 10 mmol/L to 50 mmol/L, and the chloride ion concentration is 10 ppm or less.

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Inventors:

INOUE JUNTA (JP)
FURUYAMA DAIKI (JP)
KATASE TAKUMA (JP)

Application Number:

PCT/JP2022/041470

Publication Date:

May 11, 2023

Filing Date:

November 08, 2022

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

C25D3/38; C25D5/16; C25D7/00

Domestic Patent References:

WO2020040120A1

2020-02-27

Foreign References:

JP2015533946A	2015-11-26
JP2001152387A	2001-06-05
JP2017020082A	2017-01-26
JP2010121194A	2010-06-03

Attorney, Agent or Firm:

MATSUNUMA Yasushi et al. (JP)

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