Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE-MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048463
Kind Code:
A1
Abstract:
This actinic ray-sensitive or radiation-sensitive resin composition comprises a resin which includes a repeating unit represented by specific general formula (1) and a repeating unit represented by specific general formula (2), and in which at least one of the repeating unit represented by general formula (1) and the repeating unit represented by general formula (2) has a group derived from at least one metal composition selected from the group consisting of metal complexes, organic metal salts, inorganic metal compounds, and organic metal compounds. This resist film is formed of the actinic ray-sensitive or radiation-sensitive resin composition. This pattern-forming method and this electron device-manufacturing method use the actinic ray-sensitive or radiation-sensitive resin composition.
Inventors:
KAWABATA TAKESHI (JP)
SHIBUYA AINA (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
SHIBUYA AINA (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
Application Number:
PCT/JP2023/030783
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F212/14; G03F7/004; G03F7/20
Domestic Patent References:
| WO2021039407A1 | 2021-03-04 | |||
| WO2015125554A1 | 2015-08-27 |
Foreign References:
| JP2007304545A | 2007-11-22 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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