Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048464
Kind Code:
A1
Abstract:
Provided are: an actinic ray-sensitive or radiation-sensitive resin composition; and an actinic ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device manufacturing method which use said actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition contains a resin having a specific repeating unit (i), a specific repeating unit (ii), and a specific repeating unit (iii), wherein when the repeating unit (ii) has an acid-labile group, a repeating unit derived from the repeating unit (ii) decomposed under the action of acid does not correspond to the repeating unit (i).
More Like This:
Inventors:
YOSHIOKA TOMOAKI (JP)
FUKUZAKI EIJI (JP)
FUKUZAKI EIJI (JP)
Application Number:
PCT/JP2023/030784
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F212/14; G03F7/20
Domestic Patent References:
| WO2018212079A1 | 2018-11-22 | |||
| WO2019167737A1 | 2019-09-06 | |||
| WO2020195428A1 | 2020-10-01 |
Foreign References:
| JP2022066864A | 2022-05-02 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
Download PDF: