Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026522
Kind Code:
A1
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition which exhibits excellent DOF and is capable of forming a resist film that has excellent water followability; a resist film; a pattern forming method; and a method for producing an electronic device. This active light sensitive or radiation sensitive resin composition contains a resin, the solubility of which in an aqueous alkaline solution increases by the action of an acid, a compound which produces an acid when irradiated with active light or radiation, an ester compound and a fluorine-containing polymer; and the ester compound exhibits alkali degradability, while having a molecular weight of 50 or more but less than 1,500.
Inventors:
NISHIO RYO (JP)
TAKADA AKIRA (JP)
GOTO AKIYOSHI (JP)
TANGO NAOHIRO (JP)
MARUMO KAZUHIRO (JP)
O KEIYU (JP)
TAKADA AKIRA (JP)
GOTO AKIYOSHI (JP)
TANGO NAOHIRO (JP)
MARUMO KAZUHIRO (JP)
O KEIYU (JP)
Application Number:
PCT/JP2018/025482
Publication Date:
February 07, 2019
Filing Date:
July 05, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F20/10; C08F20/22; G03F7/039; G03F7/11; G03F7/20
Foreign References:
| JP2016212403A | 2016-12-15 | |||
| JP2012137565A | 2012-07-19 | |||
| JP2012190008A | 2012-10-04 | |||
| JP2006048029A | 2006-02-16 | |||
| JP2013068776A | 2013-04-18 | |||
| JP2015135490A | 2015-07-27 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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