Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/162836
Kind Code:
A1
Abstract:
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (P) which can be decomposed by the action of an acid to increase the polarity thereof and a compound (Q) represented by a specific general formula (Q1); an active-ray-sensitive or radiation-sensitive film formed from the active-ray-sensitive or radiation-sensitive resin composition; a pattern formation method using the active-ray-sensitive or radiation-sensitive resin composition; and a method for manufacturing an electronic device.
Inventors:
KAMINO YUKA (JP)
MIYOSHI TARO (JP)
YOSHIOKA TOMOAKI (JP)
YAMAGUCHI SHUHEI (JP)
MIYOSHI TARO (JP)
YOSHIOKA TOMOAKI (JP)
YAMAGUCHI SHUHEI (JP)
Application Number:
PCT/JP2023/005337
Publication Date:
August 31, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C49/443; C07C49/67; C07C49/697; C07C325/02; C07C381/12; C07D213/68; C07D231/20; C07D231/22; G03F7/039; G03F7/20
Domestic Patent References:
| WO2022024856A1 | 2022-02-03 |
Foreign References:
| US20160070167A1 | 2016-03-10 | |||
| JP2015114632A | 2015-06-22 | |||
| JP2006195283A | 2006-07-27 | |||
| JP2006091766A | 2006-04-06 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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