Title:
POSITIVE ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/162837
Kind Code:
A1
Abstract:
The present invention provides: a positive active-ray-sensitive or radiation-sensitive resin composition comprising (A) a resin having repeating units (a) represented by a specific general formula (a) and (B) a compound that produces acid in response to the irradiation of active-rays or radiation; an active-ray-sensitive or radiation-sensitive film, pattern formation method and electronic device manufacturing method using the active-ray-sensitive or radiation-sensitive resin composition; and a compound that can be suitably used in the active-ray-sensitive or radiation-sensitive resin composition.
Inventors:
FUKUZAKI EIJI (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
MIYOSHI TARO (JP)
KAMINO YUKA (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
MIYOSHI TARO (JP)
KAMINO YUKA (JP)
Application Number:
PCT/JP2023/005338
Publication Date:
August 31, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F24/00; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2018056369A1 | 2018-03-29 |
Foreign References:
| JPH01156306A | 1989-06-19 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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