Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/162838
Kind Code:
A1
Abstract:
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A) having repeating units (a) represented by a specific general formula (a); an active-ray-sensitive or radiation-sensitive film formed by using the active-ray-sensitive or radiation-sensitive resin composition; and a pattern formation method and electronic device manufacturing method using the active-ray-sensitive or radiation-sensitive resin composition.
Inventors:
FUKUZAKI EIJI (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
MIYOSHI TARO (JP)
KAMINO YUKA (JP)
YAMAGUCHI SHUHEI (JP)
YOSHIOKA TOMOAKI (JP)
MIYOSHI TARO (JP)
KAMINO YUKA (JP)
Application Number:
PCT/JP2023/005339
Publication Date:
August 31, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F24/00; G03F7/20
Domestic Patent References:
| WO2020137918A1 | 2020-07-02 | |||
| WO2020004306A1 | 2020-01-02 | |||
| WO2020004306A1 | 2020-01-02 | |||
| WO2011027782A1 | 2011-03-10 |
Foreign References:
| JPH01130976A | 1989-05-23 | |||
| CN106986969A | 2017-07-28 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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