Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048281
Kind Code:
A1
Abstract:
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A), which includes a repeating unit represented by formula (1) and a main chain of which is decomposed by irradiation with active rays or radiation, and at least one compound (B) which is selected from the group consisting of a non-ionic basic compound (B2) and an onium salt (B1) including an anion, the pKa of a conjugate acid thereof being not less than two; a resist film; a pattern formation method; and an electronic device production method including the pattern formation method. Thus, provided are an active-ray-sensitive or radiation-sensitive resin composition, a resist film, a pattern formation method, and an electronic device production method comprising the pattern formation method, which provide excellent resolution. In formula (1), R1 represents a hydrogen atom, a halogen atom, or an organic group.
Inventors:
BEKKI YOSUKE (JP)
ISHIJI YOHEI (JP)
GOTO AKIYOSHI (JP)
TAKAHASHI SATOMI (JP)
ISHIJI YOHEI (JP)
GOTO AKIYOSHI (JP)
TAKAHASHI SATOMI (JP)
Application Number:
PCT/JP2023/029608
Publication Date:
March 07, 2024
Filing Date:
August 16, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; G03F7/004
Domestic Patent References:
| WO2022158323A1 | 2022-07-28 | |||
| WO2020241099A1 | 2020-12-03 |
Foreign References:
| JP2000147777A | 2000-05-26 | |||
| JP2014232309A | 2014-12-11 | |||
| JP2022056373A | 2022-04-08 | |||
| JP2015031842A | 2015-02-16 | |||
| JP2014024999A | 2014-02-06 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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