Title:
ACTUATOR
Document Type and Number:
WIPO Patent Application WO/2012/070324
Kind Code:
A1
Abstract:
A movable body (40) is provided by elliptically punching a sheet material, which has an insulating layer (42) formed on the surface of a bimetal (41), and a resistance layer (43) formed on the surface of the insulating layer. A power feed conductor (51A) is bonded to the circumference of a hole (34) formed in a substrate (31), and an insulating supporting body (51B) is fitted in the power feed conductor (51A). Furthermore, a fixed contact (53) is fitted in a hole (35) formed in the substrate (31). The insulating supporting body (51B) is fitted in a hole (H1) of the movable body. In such state, the power feed conductor (51A) is electrically connected to the resistance layer (43). A movable contact (52) is fitted in a hole (H2) of the movable body. When voltages are applied to power feed terminals (32, 33), the resistance layer (43) generates heat, and when the temperature of the bimetal (41) exceeds the operation temperature, the movable body (40) has the convex surface thereof and the concave surface thereof inverted by snap operation. Consequently, a low-cost actuator, which has high thermal response of the bimetal and is suitable for height reduction is configured.
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Inventors:
KOTANI KENICHI (JP)
KAMITANI GAKU (JP)
KAMITANI GAKU (JP)
Application Number:
PCT/JP2011/073492
Publication Date:
May 31, 2012
Filing Date:
October 13, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KOTANI KENICHI (JP)
KAMITANI GAKU (JP)
KOTANI KENICHI (JP)
KAMITANI GAKU (JP)
International Classes:
H01H37/14; H01H37/54
Foreign References:
JP2007035538A | 2007-02-08 | |||
JPS58193483A | 1983-11-11 | |||
JP2002279877A | 2002-09-27 | |||
JPS55109243U | 1980-07-31 | |||
JPS3618349Y1 | ||||
JPS5620913Y2 | 1981-05-18 | |||
JPS57185171A | 1982-11-15 | |||
JPH03194901A | 1991-08-26 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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Claims:
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