Title:
ADDITIVE FOR ELECTROLYTIC PLATING SOLUTIONS, ELECTROLYTIC PLATING SOLUTION, ELECTROLYTIC PLATING METHOD AND NOVEL COMPOUND
Document Type and Number:
WIPO Patent Application WO/2020/241338
Kind Code:
A1
Abstract:
An additive for electrolytic plating solutions, which contains a compound represented by general formula (1). (In formula (1), each of R1-R3 independently represents a group represented by general formula (2); A1 represents an alkanediyl group having 2-4 carbon atoms; and n represents 0 or 1.) (In formula (2), each of R4 and R5 independently represents a hydrogen atom or an alkyl group having 1-4 carbon atoms; each of A2 and A3 independently represents an alkanediyl group having 2-4 carbon atoms; m represents an integer of 1-4; and * represents a bonding hand.)
Inventors:
TAKAHASHI TAKUYA (JP)
ISHIWATA SHINYA (JP)
HATSUKADE TOMOKO (JP)
ISHIWATA SHINYA (JP)
HATSUKADE TOMOKO (JP)
Application Number:
PCT/JP2020/019591
Publication Date:
December 03, 2020
Filing Date:
May 18, 2020
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C25D3/38
Domestic Patent References:
| WO2019044651A1 | 2019-03-07 |
Foreign References:
| JP2018100260A | 2018-06-28 | |||
| CN102675535A | 2012-09-19 | |||
| CN110734735A | 2020-01-31 |
Other References:
YANG, XIAOYAN ET AL.: "Investigation of dendrimer‐based supramolecular networks as a new clay stabilizer for oil field", JOURNAL OF APPLIED POLYMER SCIENCE, vol. 137, no. 36, 25 January 2020 (2020-01-25), pages 49078, XP055766464
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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