Title:
ADDITIVE FOR RESIST UNDERLAYER FILM-FORMING COMPOSITION, AND RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2015/012172
Kind Code:
A1
Abstract:
[Problem] To provide: an additive for a resist underlayer film-forming composition that modifies the surface state of a resist underlayer film into a hydrophobic state in order to increase adhesiveness between the resist underlayer film and the resist pattern formed on the resist underlayer film; and a resist underlayer film-forming composition containing the additive. [Solution] An additive for a resist underlayer film-forming composition containing a polymer that has the structural unit represented by formula (1), and a resist underlayer film-forming composition containing a resin binder, an organic solvent, and the aforementioned additive. (In the formula: R1 represents a hydrogen atom or a methyl group; L represents a single bond or a bivalent linking group; and X, which does not have a hydroxy group, represents an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, or a heterocyclic group wherein a heteroatom is an oxygen atom.)
Inventors:
FUJITANI NORIAKI (JP)
ENDO TAKAFUMI (JP)
OHNISHI RYUJI (JP)
SAKAMOTO RIKIMARU (JP)
ENDO TAKAFUMI (JP)
OHNISHI RYUJI (JP)
SAKAMOTO RIKIMARU (JP)
Application Number:
PCT/JP2014/068933
Publication Date:
January 29, 2015
Filing Date:
July 16, 2014
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
G03F7/11; H01L21/027
Foreign References:
| JP2008257188A | 2008-10-23 | |||
| JP2005049810A | 2005-02-24 | |||
| JP2003057828A | 2003-02-28 | |||
| JP2008203364A | 2008-09-04 | |||
| JP2002072489A | 2002-03-12 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
Sepal Tsuneo (JP)
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