Title:
ADHESIVE AGENT FOR HIGH-FREQUENCY INDUCTION HEATING
Document Type and Number:
WIPO Patent Application WO/2022/004606
Kind Code:
A1
Abstract:
Provided is an adhesive agent (adhesive sheet 1A) for high-frequency induction heating, the adhesive agent (adhesive sheet 1A) for high-frequency induction heating containing at least a thermoplastic resin (A) and a dielectric filler (B) that emits heat when a high-frequency electrical field is applied. The thermoplastic resin (A) contains at least a first thermoplastic resin (A1) and a second thermoplastic resin (A2). The first thermoplastic resin (A1) is a silane-modified thermoplastic resin, and the second thermoplastic resin (A2) is a non-silane-modified thermoplastic resin.
Inventors:
TSUCHIBUCHI KOJI (JP)
TAYA NAOKI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/024196
Publication Date:
January 06, 2022
Filing Date:
June 25, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/04; B29C65/32; B29C65/36; C09J7/35; C09J123/04; C09J123/10; C09J123/26; C09J201/02
Domestic Patent References:
WO2018079355A1 | 2018-05-03 | |||
WO2018147351A1 | 2018-08-16 |
Foreign References:
JPS6056549A | 1985-04-02 | |||
JPH03137179A | 1991-06-11 | |||
JP2002144341A | 2002-05-21 | |||
JP2003238745A | 2003-08-27 | |||
JP2004002549A | 2004-01-08 | |||
JP2002097445A | 2002-04-02 | |||
JP2016068426A | 2016-05-09 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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