Title:
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET, JOINING METHOD, AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2022/004605
Kind Code:
A1
Abstract:
A high-frequency dielectric heating adhesive sheet (1A) having an adhesive layer (10), wherein the adhesive layer (10) contains a thermoplastic resin (A) having a reactive site (Y), a dielectric filler (B) that generates heat due to application of a high-frequency magnetic field, and a silane coupling agent (C).
Inventors:
TSUCHIBUCHI KOJI (JP)
TAYA NAOKI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/024195
Publication Date:
January 06, 2022
Filing Date:
June 25, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B29C65/32; C09J7/35; C09J11/04; C09J11/06; C09J123/00; C09J201/02
Domestic Patent References:
| WO2018147351A1 | 2018-08-16 | |||
| WO2018147352A1 | 2018-08-16 | |||
| WO2005086557A1 | 2005-09-15 | |||
| WO2018147352A1 | 2018-08-16 |
Foreign References:
| JPH03137179A | 1991-06-11 | |||
| JP2004107588A | 2004-04-08 | |||
| JP2013104052A | 2013-05-30 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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