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Title:
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/059640
Kind Code:
A1
Abstract:
An adhesive agent for semiconductors, which comprises a thermoplastic resin, a heat-curable resin, a curing agent and an organic acid, in which the organic acid is a compound having at least two acidic functional groups and having an acid dissociation constant pKa of 4.0 or less.

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Inventors:
KAWAMATA RYUTA (JP)
MIYAHARA MASANOBU (JP)
MASUNO DAISUKE (JP)
NAKADA TAKAHIRO (JP)
CHABANA KOICHI (JP)
IWABUCHI RYUNOSUKE (JP)
Application Number:
PCT/JP2021/033517
Publication Date:
March 24, 2022
Filing Date:
September 13, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; H01L21/60; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
WO2012153846A12012-11-15
WO2018235854A12018-12-27
WO2012053589A12012-04-26
Foreign References:
JP2014209624A2014-11-06
JP2019173023A2019-10-10
JP2004179552A2004-06-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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