Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/136272
Kind Code:
A1
Abstract:
This adhesive composition contains (A) an epoxy resin, (B) a curing agent, and (C) a film-forming component, wherein component (A) includes more than 90 mass% of an aromatic epoxy resin with respect to the total amount of component (A), the aromatic epoxy resin including a polyfunctional epoxy resin having a skeleton represented by general formula (1), and component (B) includes an onium-based compound. [In formula (1), X1 represents an oxygen atom, a sulfur atom, or a C1-10 alkylene group.]
Inventors:
YAMAZAKI YUTA (JP)
TOMISAKA KATSUHIKO (JP)
MORIYA TOSHIMITSU (JP)
KOBAYASHI RYOHTA (JP)
TOMISAKA KATSUHIKO (JP)
MORIYA TOSHIMITSU (JP)
KOBAYASHI RYOHTA (JP)
Application Number:
PCT/JP2023/000529
Publication Date:
July 20, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J9/02; C09J7/30; C09J11/00; C09J11/06; C09J11/08; C09J163/00; H01B1/20; H05K1/03
Domestic Patent References:
| WO2016158268A1 | 2016-10-06 | |||
| WO2000009623A1 | 2000-02-24 |
Foreign References:
| JPH08315885A | 1996-11-29 | |||
| JPH04217675A | 1992-08-07 | |||
| JPS4974800A | 1974-07-18 | |||
| JP7133746B1 | 2022-09-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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