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Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/136273
Kind Code:
A1
Abstract:
An adhesive composition comprising (A) an epoxy resin and (B) a curing agent, said adhesive composition containing a multifunctional epoxy resin as the component (A) and a pyridinium salt as the component (B), wherein the pyridinium salt has a benzyl group at position 1 and an electron withdrawing group at position 2, and the benzyl group has an electron donating group.

Inventors:
YAMAZAKI YUTA (JP)
TOMISAKA KATSUHIKO (JP)
MORIYA TOSHIMITSU (JP)
KOBAYASHI RYOHTA (JP)
Application Number:
PCT/JP2023/000533
Publication Date:
July 20, 2023
Filing Date:
January 12, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J9/02; C09J7/30; C09J11/06; C09J163/00; H01B1/20; H05K1/03
Foreign References:
JPH09194816A1997-07-29
JPH05262813A1993-10-12
JPH055006A1993-01-14
JPH03109465A1991-05-09
JPH01299803A1989-12-04
JP2022164657A2022-10-27
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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