Title:
ADHESIVE COMPOSITION FOR LAMINATING, LAMINATE, AND SECONDARY BATTERY
Document Type and Number:
WIPO Patent Application WO/2017/187904
Kind Code:
A1
Abstract:
An adhesive composition for laminating which comprises a modified polyolefin resin (A) having a melting point of 90°C or lower, a modified polyolefin resin (B) having a melting point that is higher than that of the modified polyolefin resin (A) and is not higher than 140°C, and a hardener (C), wherein the proportion of the modified polyolefin resin (B) to the sum, on a solid basis, of the modified polyolefin resin (A) and the modified polyolefin resin (B) is 0.1-20 mass%; a laminate in which the adhesive composition for laminating was used as an adhesive for a metal layer and a polyolefin resin layer; and a secondary battery which includes the laminate as an electrolytic-solution-enclosing film or an electrode-part-protecting film.
More Like This:
Inventors:
NAKAMURA HIDEMI (JP)
MATSUO TAKATOSHI (JP)
KOUYAMA TATSUYA (JP)
MATSUO TAKATOSHI (JP)
KOUYAMA TATSUYA (JP)
Application Number:
PCT/JP2017/014036
Publication Date:
November 02, 2017
Filing Date:
April 04, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J123/26; B32B15/085; B32B27/00; B32B27/26; C09J11/06; H01M2/02; H01M2/06
Domestic Patent References:
WO2016042837A1 | 2016-03-24 | |||
WO2013114934A1 | 2013-08-08 | |||
WO2015111488A1 | 2015-07-30 | |||
WO2016075975A1 | 2016-05-19 |
Foreign References:
JP2015145064A | 2015-08-13 | |||
JPH09111069A | 1997-04-28 |
Other References:
T ECHNICAL DATA SHEET GMP7550E, 24 April 2014 (2014-04-24), pages 1, Retrieved from the Internet [retrieved on 20170529]
Attorney, Agent or Firm:
KONO Michihiro (JP)
Download PDF:
Previous Patent: METHOD FOR MANUFACTURING COMPOSITE WAFER
Next Patent: IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS
Next Patent: IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS